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熱門職缺
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職務名稱 職務 學歷 應徵條件
LE 1 - IC佈局工程師
IC Analog / Digital Fully Layout
學士以上

電子電機相關
1. 具 IC Analog layout 經驗尤佳
PE - Product Engineer (SOC)
1. With experience of process development and silicon process background is required.
2. Research and development of product verification and debugging
MSEE or MSc required

1. Product verification & debugging.
2. Product mss production managmet.
3. Yield analysis & improvement.
4. Failure analysis and improvement.
DTE - Senior DFT Engineer
SOC IC design for testability.
MSEE or related fields

1. 熟悉 ASIC design flow, 且具有三年以上相關實務經驗
2. Experience on the following EDA tools: DFT Compiler, Design Compiler, PrimeTime, Mentor TestKompress, fastscan etc.
3. Experience on RTL design, and familiar with Tcl/TK, C- Shell, Perl.
PE - Product Engineer (Driver)
1. With experience of process development and silicon process background is required.
2. Research and development of product verification and debugging
MSEE or MSc required

1. Product verification & debugging.
2. Product mss production managmet.
3. Yield analysis & improvement.
4. Failure analysis and improvement.
TE - Testing Engineer (SOC)
1. Reserach and development of IC testing
BSEE or MSEE or related fields

TE - Testing Engineer (CMOS)
1. Reserach and development of IC testing.
BSEE or MSEE or related fields

1. With 2 year of IC testing experience is preferred.
QA - 產品品質工程師
協助客戶端產品服務,回饋客戶端問題給內部開發部門
BSEE or related fields

1. 溝通,組織能力強,擅長IC 故障分析技術問題
2. 個性隨和,能與客戶配合,熱衷服務助人者尤佳
3. 可配合外派工作
QA - 客服工程師
Bachelor or above in Engineer or Science related.

1. Familiar with IC Fab. Process flow and LCD driver assembly process flow.
2. Have QA related training.
3. Good communication capability
4. Good EQ manner
PE - Package Engineer
【職務說明】
1. 先進封裝技術評估,研發和導入先進Bump, Flip Chip, SiP及3D-IC封裝技術
2. 封裝廠外包商管理,配合晶圓技術發展和客戶封裝方案需求,規劃和開發先進晶圓研磨、切割和Bumping等技術
3. 新產品導入工程和樣品生產規劃
4. 封裝相關工程問題之偵錯改善
Bachelor or above in Engineer or Science related.

1. 具3年以上TFT LCD driver IC封裝廠經驗或2年以上TFT LCD系統相關產業之工程技術經驗。
2. 熟悉可靠度評估流程、熟悉TSV及3D-IC結構或具Cu pillar開發經驗尤佳。
3. 熟悉TFT LCD系統組裝、開發或生產流程尤佳。
4. 擅長溝通協調、態度積極、有創造性、團隊合作、具良好人際關係,有team leading經驗者尤佳。
CMOS - 先進感光元件設計工程師/經理
負責CIS感光元件設計研發及測試
1. 負責CIS感光元件相關製程開發,需與FAB協調溝通
MSEE or related fields.

1. 熟悉半導體元件特性與製程,具8年以上CMOS image sensor相關產品製程開發實務經驗
2. 具製程模擬實務經驗,熟悉CIS相關電路原理
3. 具CMOS image sensor各種參數的量測與資料分析實務經驗
4. 有管理設計團隊經驗佳
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