Introduced a next-generation PMIC that delivers improved GMA OP ripple performance and incorporates a dynamic Vint OP adjustment feature (Dynamic Vint). This innovation effectively mitigates low luminance display artifacts such as water ripple effects and enhances visual performance under varying frame rate conditions.

Introduced a new-generation LCD NB Driver IC adopting the New CHPI protocol. Through close collaboration with the TCON, the driver IC incorporates Smart CS and Dynamic PWRC functions, achieving ultra-low power consumption in dual-gate panel architectures. Manufactured using an advanced 0.11 μm 7V process, and enhanced with HDR and Slew Rate Enhancement (SRE) functions to improve drive slew rate, the product delivers a low-power, high-driving-capability driver IC design within the same silicon area.

Introduced TCON embedded scaler.

Integrated in-house enhanced image-processing technology, Beyond Vision, delivering improved contrast performance while reducing power consumption. It also incorporates a next-generation OLED Pixel Compensation IP, covering pixel-aging compensation, luminance/chromaticity uniformity correction, and real-time compensation algorithms, significantly reducing color shift and luminance instability during high-brightness HDR or rapid scene transitions. Further supports mainstream OLED manufacturing processes and upcoming high-brightness technologies such as tandem OLED and inkjet printing (IJP), combined with a flexible firmware and parameter-management framework.

Introduced an OLED NB DDIC manufactured using a 55nm 1.2V/8V process technology, combined with 55 nm LV devices. By optimizing the receiver CPOP architecture and OTA design, the solution achieves a power consumption of approximately 30mW per IC at 2.5 Gbps in a four-pair configuration, representing a reduction of approximately 70mW compared with the previous generation. As applied in OLED NB applications, the solution enables a total panel power consumption reduction of approximately 280mW, meeting the targeted power-saving objectives.

Introduced DP2.1 20G AI embedded gaming display controller.

Introduced an embedded TCON product supporting dual COF/COG configurations, featuring built in support for up to 30 OSD functions and VDOC safety comparison capabilities. This solution provides a highly competitive offering for automotive digital instrument clusters and electronic rearview mirror applications.

Introduced TSMC 4nm chip. Leveraging advanced process and chiplet technology, integrates a high-speed ARM GPU/NPU/DSP IP and high-speed interfaces such as DDR5, PCIe, UCIe, HBM, and SerDes, providing a versatile ASIC service for high performance computing and edge-service applications.

Introduced a high‑performance power management IC (PMIC_5120) compliant with JEDEC standards, supporting high‑speed DDR5 memory up to 9200MT/s. It significantly enhances the operating performance and power management efficiency of AI PCs. The product has passed Intel’s official certification (AVL), demonstrating high stability and compatibility. When paired with the company’s DDR5 SPD and CKD products, it delivers a complete and comprehensive DDR5 memory solution.

Introduced a new-generation OLED TV driver IC featuring a single-pair receiver (1-pair Rx) architecture, supporting UHD resolution at refresh rates of up to 165 Hz with an operating data rate of up to 4.5 Gbps. The solution enhances RX noise immunity, enabling it to withstand power disturbances induced by the PCB during ADC sensing operations, thereby preventing unlock events caused by UI shift. In addition, RX power consumption has been further optimized, allowing normal operation at approximately 70% of the power consumption of the previous generation.

Developed a new Buck-Boost converter for ELVDD, capable of providing the necessary voltage for LTPS/LTPO OLED panels across the entire battery voltage range, with a ripple of less than 20mV to ensure picture quality.

Introduced a 28 nm uOLED (3700 PPI) panel delivers designed for smart wearable AR glasses. Approximately 30% power reduction through dynamic ISOP and low VDDP power input. Its built in FRD (Foveated Rendering) capability boosts perceived image quality while lowering energy use in latency critical VR/AR environments.

In-Cell Touch ADDI Integration Technology:
• Provides an intelligent wake-up function, allowing notebook display panels to automatically enter a sleep state when not in use, significantly extending battery life;
• Frequency hopping and noise suppression deliver more responsive and stable touch performance;
• Multiple layers of hardware protection and data integrity checking mechanisms safeguard system reliability and help prevent cyber-attacks.

Introduced LPDDR5 PMIC for AI NB, designed to address the transition from LPDDR4 to LPDDR5 memory, which requires enhanced power delivery capability and optimized efficiency across a wide operating range. To meet the demand for extended standby time in NBs, the PMIC incorporates an adaptive power-saving control scheme that enables automatic coordination with the NB’s sleep and wake-up modes, effectively extending end-device standby duration. The product has been successfully adopted by major Taiwanese and Japanese brand manufacturers and has entered mass production.

Introduced solutions offering support for 3.8K, WQXGA and flexible resolution modes, and paired with DDICs for Oxide/LTPS panels under 14.8”, our solution enables oxide displays up to 3.2K. Enhanced ARP combined with frame dimming delivers roughly 20% power savings.

The world’s first 22nm high pin-count AMOLED TDDI has been introduced, supporting resolutions up to 2520×2300. By delivering superior power efficiency and ultimately simplified display mechanism which were contributed by NOVATEK’s leading OLED TDDI technology, the ICs are great fit for next generation folded smart phone device. Allowing devices to be ultra-thin while significantly extending standby time of mobile devices. The touch circuitry integrates dedicated convolution hardware and combine with AI machine learning algorithm that can significantly enhance touch sensitivity. Delivering a seamless, human-machine-integrated touch experience for users.

Introduced innovative real RGB 1.5K FHD+ OLED driver IC for smartphones. It reduces power consumption in high-end smartphones by more than 20%. Comparing with existing SPR display, the real RGB DDICs built-in Novatek in-house color enhancement algorithms making the panels with more vivid and realistic visual. It offers consumers a more pleasing and premium visual experience.

Introduced a new-generation LCD monitor driver IC designed to support UHD applications at refresh rates of up to 240 Hz, with a data rate of up to 4.2 Gbps using a dual-pair receiver architecture. By adopting enhanced IOHL levels and incorporating Hyper Slew Rate technology, the driver IC achieves high driving capability while maintaining low power consumption. For a 27-inch UHD panel operating at 120 Hz, total system power consumption was reduced by approximately 0.9 W compared with the previous generation, exceeding customer expectations.

Introduced embedded TCON supporting built-in OSD and local dimming function LTPS TED product for automotive PHUD (Panoramic Head-Up Display) and best instrument cluster solution.

Introduced a new-generation 2K60 smart TV SoC. Supporting global standard demod, optimizing chip cost and power consumption for mainstream 2K60 products, further reducing PCB size to achieve major TV manufacturers’ ESG enhancement goals, and simultaneously supporting multi-view HW DRM to fulfill VoD services’ security requirement.

Introduced a new-generation Edge AI SoC featuring a self-developed NPU architecture, purpose-built for on-device multi-model and multimodal large language models (MLLMs). It enables generative AI capabilities at the edge, delivering inference performance exceeding 20 TPS for 7B-parameters level LLMs. The product can be deployed as an AI Box, providing plug-and-play AI computing power for existing IPCAM, NVR, and NAS systems without the need to replace current hardware. It also supports PCIe multi-core cascading architectures, offering strong scalability and making it well suited for a wide range of edge applications, including robotics and AI agents.

Introduced a new-generation machine vision chip (Edge Vision & Imaging AI SoC), enabling the deployment of AI Vision-Language Models (VLMs) at the edge. It supports intelligent image processing, scene recognition, and advanced AI system capabilities. Its applications include:
• Security and surveillance products: Enables natural-language-based object recognition and search, delivering real-time intelligent video analytics, advanced scene understanding, and outstanding ultra-low-light imaging performance.
• Automotive vision systems: Supports low-latency HDR, real-time visual intelligence, and AI sensing capabilities required for APA, CMS, DMS, and OMS applications.
• Consumer imaging products: Provides intelligent Ultra-HD 4K imaging, advanced electronic image stabilization (EIS), optimized encoding, and intelligent image capture capabilities for action cameras, vlog cameras, and dashcams.

Introduced TDDI products supporting dual LVDS and iSP interfaces, as well as multichip cascade LTDI solutions. The TDDI products feature built in DP_MUX4 and TP_MUX functions, enabling a single chip solution that delivers a highly competitive offering for 15.6-inch FHD and WQXGA automotive center information display applications.